R&D and Intellectual Property

🌟 R&D Vision

Enhance brightness and efficiency to meet the evolving demands of the lighting and display industries.

🚩 Short-term Goals

Developing customized products that precisely align with market trends and specific customer requirements.

🔭 Long-term Goals

Focusing on telecommunications, automotive, and color display industries, leveraging proprietary technology to develop ultra-high brightness and high-power LED solutions.

📊 Patent Statistics by Region

Type / Country	Taiwan	China	USA	Korea	Germany	Japan	EU	Total
Invention	137	77	105	9	2	4	1	335
Utility Model	109	95	0	6	10	7	0	227
Design	16	11	13	5	1	0	0	46
Total	262	183	118	20	13	11	1	608

📜 Major Patents Portfolio

2021

• LED Display Module (Taiwan Invention Patent: I728779)

2020

• Light Emitting Device (China Invention Patent: CN108709100B)
• LED Package Structure (Taiwan Invention Patent: I710147)
• DISPLAY DEVICE (U.S. Invention Patent: US10818644B2)
• Light Emitting Device (Taiwan Invention Patent: I690095)

2019

• Display Module (Taiwan Invention Patent: I6604795)
• Display Panel and Composite Display Panel (China Invention Patent: CN106257326B)
• LED ARRAY PACKAGE WITH MULTIPLE POWER SIGNALS (U.S. US10355185B2)
• Light Board Module for LED Display (Taiwan Invention Patent: I676845)

2018

• LED Package (Taiwan Invention Patent: I636590)
• Light Emitting Device (Taiwan Invention Patent: I636595)
• LED Component (Taiwan Invention Patent: I620343)
• LED PACKAGE STRUCTURE WITH PLANE LIGHT SOURCE (U.S. US9978917B1)
• LIGHT EMITTING DEVICE (U.S. Invention Patent: US10060600B1)

2013 Highlights

• LED Chip Package Structure with Embedded ESD Protection (Taiwan I384649)
• Package Structure to Prevent Fluorescent Powder Efficiency Loss (Taiwan I389294)
• LAMP HEAD ASSEMBLY AND LIGHTING LAMP TUBE (U.S. 8398275)
• LED Package Structure Using Secondary Packaging Method (Taiwan I411140)
• Wafer-level LED Package Structure for Improved Heat Dissipation (Taiwan I415308)
• Conductive Substrate Structure Formed by Two-sided Cut Approach (U.S. 8555492)

2011 - 2012 Selection

• LED Package Structure for Backlight Modules (Taiwan I358121)
• ILLUMINATION DEVICE WITH A FIRE-FIGHTING FUNCTION (U.S. 8162514)
• Wafer-level Vertical Diode Package Structure (China CN101685836B)
• Package Method for High-Efficiency Side-Emitting Effect (U.S. US7951621)
• Ceramic Substrate-based Perforated LED Chip Package (U.S. US8003413)
• Reflective Light Module with High Heat Dissipation (U.S. US8079737)

2007 - 2010 Portfolio

• Slim Package Structures (China 630939, U.S. US7842964)
• Light Bar Applications (Taiwan I298529, Korea 100872947, U.S. 7815346)
• High Heat Dissipation Lighting Modules (U.S. 7828464)
• High-Power LED Technologies (Taiwan 207771, U.S. 7485480B2)
• Display Driver Circuits and Methods (Taiwan I281655, Korea 0818751)
• Flashlight Module Structures (U.S. US7255643 B2, Korea 0733845)