🚩 Short-term Goals

Align with customer needs to precisely develop high-performance products that meet market and client expectations.

🔭 Long-term Goals

Focus on communication, automotive, and color display industries, leveraging proprietary technology to develop ultra-high brightness and high-power LED products.

2021

• • LED Display Module (Taiwan Invention Patent: I728779)

2020

• • Light Emitting Device (China Invention Patent: CN108709100B)
• • Package Structure for Light Emitting Diodes (Taiwan Invention Patent: I710147)
• • DISPLAY DEVICE (US Invention Patent: US10818644B2)
• • Light Emitting Device (Taiwan Invention Patent: I690095)

2019

• • Display Module (Taiwan Invention Patent: I6604795)
• • Display Panel and Composite Display Panel Utilizing the Same (China Invention Patent: CN106257326B)
• • LIGHT EMITTING DIODE ARRAY PACKAGE HAVING A PLURALITY OF SOURCE SIGNALS (US US10355185B2)
• • Lamp Board Module for LED Display Screens (Taiwan Invention Patent: I676845)

2018

• • Light Emitting Diode Package (Taiwan Invention Patent: I636590)
• • Light Emitting Device (Taiwan Invention Patent: I636595)
• • Light Emitting Diode Component (Taiwan Invention Patent: I620343)
• • LIGHT-EMITTING DIODE PACKAGE STRUCTURE HAVING PLANE LIGHT SOURCE (US US9978917B1)
• • LIGHT EMITTING DEVICE (US Invention Patent: US10060600B1)

2017

• • DISPLAY PANEL AND COMPOSITE DISPLAY PANEL (US US9563076B2)
• • DISPLAY DEVICE AND LIGHT-EMITTING ARRAY MODULE (US US9685428B2)
• • Thin Planar Light Source Module (Taiwan Invention Patent: I603028)

2013

• Light-emitting diode chip package structure with embedded electrostatic discharge (ESD) function and manufacturing method thereof (Taiwan Invention Patent I384649)
• Light-emitting diode chip package structure for avoiding degradation of phosphor emission efficiency due to high temperature and manufacturing method thereof (Taiwan Invention Patent I389294)
• LAMP HEAD ASSEMBLY AND LIGHTING LAMP TUBE (US Invention Patent 8398275)
• Light-emitting diode package structure utilizing secondary packaging and manufacturing method thereof (Taiwan Invention Patent I411140)
• Light-emitting module for limiting light projection angles in long-side and short-side directions (Taiwan Invention Patent I410579)
• CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME (US Invention Patent 8555492)
• SIMPLE DETACHABLE ILLUMINATION STRUCTURE AND LAMP TUBE (US Invention Patent 8556463)
• Wafer-level light-emitting diode package structure for increasing luminous efficiency and heat dissipation effect and manufacturing method thereof (Taiwan Invention Patent I415308)
• Light-emitting diode structure with high-efficiency heat dissipation effect and manufacturing method thereof (Taiwan Invention Patent I419383)

2012

• • Light-emitting diode chip package structure for backlight modules and manufacturing method thereof (Taiwan I358121)
• • Light-emitting diode chip package structure using substrate as lamp shade and manufacturing method thereof (Taiwan I357964)
• • Light-emitting diode chip package structure using deposition method and manufacturing method thereof (China CN101645477B)
• • Package structure achieving frontal electrical conduction without wire bonding (China CN101567344B)
• • ILLUMINATION DEVICE WITH A FIRE-FIGHTING FUNCTION (US 8162514)
• • Wafer-level vertical diode package structure and manufacturing method thereof (China CN101685836B)
• • LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same (US Invention Patent 8198800)
• • Reflective light-emitting module with high heat dissipation and high luminous efficiency (Taiwan I368009)
• • Lighting management system for golf courses and control method thereof (China CN101527984B)
• • CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME (US Invention Patent 8263876)
• • Light-emitting module for limiting light projection angles in long-side and short-side directions (China CN102136543B)

2011

• • Chip package structure with embedded electrostatic discharge protection function (US US7876593)
• • Wafer-level package structure for increasing conductive and heat dissipation areas (US US7923747)
• • Packaging method and package structure with high-efficiency light-emitting effect (US US7923745)
• • Packaging method and package structure with high-efficiency lateral light-emitting effect (US US7951621)
• • Through-hole light-emitting diode chip package structure using ceramic as substrate (US US8003413)
• • Light-emitting diode chip package structure using substrate as lamp shade (US US8002436)
• • Package structure for high-efficiency lateral light emission via roughened surfaces (US US8017969)
• • Flip-chip electrical connection package structure without wire bonding (US US8053904)
• • Wafer-level vertical diode package structure (US US8053885)
• • Reflective light-emitting module with high heat dissipation and high luminous efficiency (US US8079737)

 2010

• Thinned Package Structure (China Invention Patent 630939)
• L/B (US Invention Patent 7815346)
• High Heat Dissipation Lighting Module (US Invention Patent 7828464)
• L/B (US Invention Patent 7834365)

 2009

• L/B (Korea Invention Patent 100903494)
• W/L LED (US Invention Patent 7655997)
• L/B (China Invention Patent 572124)
• Thinned Package Structure (US Invention Patent 7842964)

 2008

• Light bar (Taiwan Invention Patent I298529)
• Light bar (Korea Invention Patent 100872947)
• Light bar (Korea Invention Patent 100868158)
• Hipower (US Invention Patent 7485480B2)
• Display Driver Circuit and Driving Method thereof (Korea Invention Patent 0818751)
• Display Driver Circuit and Driving Method thereof (Korea Invention Patent 0818748)

 2007

• Hi-power (Taiwan Invention Patent 207771)
• Hi-power (China Invention Patent 356668)
• Display Driver Circuit (Taiwan Invention Patent I281655)
• Flashlight Module Structure (US Invention Patent US7255643 B2)
• Flashlight Module Structure (Korea Invention Patent 0733845)